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木星款超精密运动控制平台半导体检测量测先进封装定位平台

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水星款超精密运动控制平台半导体制程关键尺寸叠片测量薄膜量测纳米级定位

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天王星款超精密运动控制平台半导体前段制程检测封装纳米级定位平台

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JUPITER most challenging requirements of advanced die bonding processes

1. ±350 nm local placement accuracy (moves with local alignment) at 10 kUPH throughput.
2. ±200 nm local placement accuracy (moves with local alignment) at 2 kUPH throughput.
3. ±1 µm global placement accuracy (blind moves).
4. <10 minutes thermal transient (from cold start to hot working state).
5. Up to 10 kUPH throughput for a typical flip chip die bonding application.
6. Up to 2 kUPH throughput for a hybrid bonding application.
7. Up to 180 kUPH throughput for µ-LED bonding.

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URANUS Wafer Process Control applications such as Overlay Metrology, Critical Dimension and Thin film Metrology Back-end: flip-chip processes made on large panels/substrates

Use of ETEL renowned iron-core motors, along with innovative design principles, allows reaching high dynamics at much improved geometrical and motion performance levels.

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MERCURY Critical-Dimension and Thickness

Acceleration20 m/s2 and speed 1.25 m/s
Position accuracy ±1 μm
Standard strokes of 475 x 410 mm
Compact footprint and design suitable for space-limited applications
Up to 6 degrees of freedom
Short move and settle times

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